Detachment 3 has a wide range of capabilities to solve your product development challenges.
High Performance ADC and DAC Subsystems
Mixed-Signal Design for Audio
DSP Hardware and Algorithm Implementation
Detailed Audio Testing and Qualification
Development of RTL and validation in Verilog and VHDL
IP design and deployment to FPGA or hard-cell silicon
High-speed interfacing through PCIe and Thunderbolt™
Power design for FPGA hardware
Experience implementing AES67, AVB/TSN and Dante™
Design of remote device control
Deployment using SoC, FPGA and partner ASICs
Specialization in high channel count systems
Rapid proof-of-concept development
User Interface Mockups and workflow analyses
Functional testing using COTS tools
Concept development for focus group testing
Feasibility analysis of new product ideas
Turning a concept into your product
Rapid virtual sketching in 3D CAD
Model creation using manual and CNC rapid prototyping methods
User interface design and development
Functional mockup creation for group feedback
Fusing disciplines into a single product
Development of unified product from the technical disciplines
Early analysis of EMC and EMI impact
Complex multi-PCB system designs in challenging packages
Quick evaluation of technology to meet product function and budget
Electronic design for your next product
System architecture and technology selection
Embedded systems design from 8-bit MCUs to multi-GHz SoCs
Power development to meet size and noise requirements
Analog and mixed-signal design for audio and control
Creating the logic to accompany hardware and enhance the user experience
Specification and modeling of complex firmware systems
Development of firmware using assembly, C, and C++ on bare metal, various RTOSes and Embedded Linux
Optimization of existing firmware for smaller memory footprint or porting to new platforms
Enclosures that fit your function and form
3D Design using SolidWorks™
Rapid prototyping using in-house FDM and CNC
Thermal and EMC analysis using HyperLynx™ and SolidWorks™ Simulation
Pre-production and pilot fabrication with local and global partners
Layout and design of printed circuits to meet your needs
Printed Circuit Design using Mentor PADS™ and Altium™ Designer
Layout of 1-32 layer rigid and flex PCBs
Vast experience with complex grounding and EMC schemes
Tight integration with mechanical engineering to optimize form factor and cost
Assembling the first product for evaluation and testing
In-House prototype assembly and validation
Electronic assembly using in-house SMT line and third party vendors
Kitting, Packaging and serialization for alpha and beta distribution
EMC Pre-scan of prototypes using in-house test chamber
Deploying a product design to the global manufacturing space
Pre-Production EMC and safety certification using in-house and partner facilities
Development of test plans and fixtures for production lines
NPI run management and integration of DFM reports from NPI
Migration to mass production through our manufacturing partners